New PDF release: Materials for Rigid and Flexible Printed Wiring Boards

By Martin W. Jawitz

ISBN-10: 082472433X

ISBN-13: 9780824724337

Complicated digital circuits and units are flooding functions in approximately each aspect of industrial and commercial task, from computerized gear to every kind of purchaser items. right collection of fabrics is important to fulfill the end-use specifications of versatile and inflexible revealed wiring forums. whereas there are lots of invaluable books and articles at the fabrication of published circuit forums, fabrics for inflexible and versatile revealed Wiring forums is the 1st publication to aspect the homes of the fabrics used and the way they're made.

The authors current vital production details and fabric homes for reinforcement fabrics, resins, versatile movies, copper foils, inflexible laminates, high-speed/high-frequency laminates, and steel center and constraining middle fabrics. they give useful counsel to aid designers, engineers, and fabricators decide on appropriate fabrics to effectively meet power, weight, thickness, functionality, fee, and different standards. normally, the cloth facts comes at once from brands' info sheets, representing ordinary values. The publication illustrates the comparative strengths and obstacles of the fabrics, highlights their uncomplicated homes, and information the producing approaches used to make them.

Offering useful information in accordance with years of expertise, fabrics for inflexible and versatile revealed Wiring forums is a one-stop resource of an important info for someone designing or construction revealed circuit forums for any program.

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Extra info for Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering)

Sample text

Dimensional stability is much improved, although not at the level of polyimide films. Provided that the adhesive is kept as thin as possible, a circuit so constructed will display some of the excellent electrical characteristics of a fusion-bonded circuit but at a lower cost. 3. fm Page 45 Wednesday, July 5, 2006 4:07 PM Flexible Films 45 Apical®. All are marketed in several derivatives with chemistries and mechanical properties custom-engineered for flexible circuit usage. These films are inherently nonburning and, when combined with specially compounded fire-retardant adhesives, produce laminates that are UL 94-VO rated.

Kevlar® was the first para-aramid polymer fiber. 3. Para-aramid fibers have a high modulus and low CTE when compared to other fibers used as reinforcements in printed wiring boards. 4 % g sec lbs/in. (kg/cm) % is in fact negative in the axial direction. When combined with thermoset resins, which typically have a high CTE in the range of 40 to 60 ppm/˚C, para-aramid fibers restrain the expansion of the resin when heat is applied to the composite laminate. The para-aramid fibers have both a low specific gravity and a low Dk.

The basic building blocks can be further modified with special diols and monomers to alter chemical, environmental, and flame-retardant properties. This combination is reacted with heat in the laminating press to complete the reaction. The polyester resin has certain inherent advantages over the other resin systems. The monomer acts as a solvent for the base resin, giving a 100% solid system. The chemistry of the polyester resin is simpler than epoxies and much easier to make fire-resistant. Epoxies are loaded with as much bromine as they can hold and that may not be enough, whereas polyesters have plenty of extra leeway before they are saturated.

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Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering) by Martin W. Jawitz


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