By Eugene R. Hnatek
ISBN-10: 0824792831
ISBN-13: 9780824792831
Examines all vital features of built-in circuit layout, fabrication, meeting and attempt approaches as they relate to caliber and reliability. This moment variation discusses intimately: the newest circuit layout expertise tendencies; the resources of blunders in wafer fabrication and meeting; avenues of illness; new IC packaging tools; new in-line technique screens and attempt buildings; and more.;This paintings may be priceless to electric and electronics, caliber and reliability, and business engineers; desktop scientists; built-in circuit brands; and upper-level undergraduate, graduate and continuing-education scholars in those disciplines.
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Handbook of Electric Motors, edited by Richard H. Engelmann and William H. Middendorf Additional Volumes in Preparation Power-Switching Converters, Simon Ang Page i Integrated Circuit Quality and Reliability Second Edition, Revised and Expanded Eugene R. Hnatek Tandem Computers Inc. Cupertino, California MARCEL DEKKER, INC. New York Basel Hong Kong Page ii Library of Congress Cataloging-in-Publication Data Hnatek, Eugene R. Integrated circuit quality and reliability / Eugene R. Hnatek. , rev. and expanded.
This chapter presents some of the significant trends that are taking place in the IC industry and that will ultimately impact upon testability. 1 summarizes the salient integrated circuit trends that are occurring. Each of these items will be substantiated by supporting data. ICs are advancing on two fronts simultaneously, almost paradoxically: 1. At the very-large-scale integration/ultra-large-scale integration (VLSI/ULSI) level with increased on-chip functional integration (memories, microprocessors, digital signal processors, and ASICS, for example).
They must maintain their focus on quality. Every person in the semiconductor industry must be dedicated to the production of quality products. Unless every person has that dedication, production yields and volumes quickly suffer, profitability drops, and company survivability soon becomes an issue. This requires formalized quality procedures and a company-wide quality mindset. So much for historical perspective. Now to the specific issues that affect IC quality. From a global IC design, manufacturing, and use perspective, sources of poor quality typically include and can be found.
Integrated circuit quality and reliability by Eugene R. Hnatek
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